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Supply Chain Programs
Statement
To ensure our products qualify with ROHS directives, Lite-On Technology engages in supply chain programs where all products must meet strict standards, using extensive compliance documentation, to ensure that electrical and electronic products sold in the EU do not contain lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBBs), and polybrominated diphenyl ethers (PBDEs) above the legal threshold. Suppliers must ensure that all products, components, materials (including packing materials), elements, additives and such in the manufacturing process and parts supplied to Lite-On Technology Corp do not contain hazardous substances.
Supply chain programs have three phases: Selecting Parts by R&D, Starting Mass Production, and Making a Change of Components.
HSF test result
|
Test Date
|
Report No
|
Product
|
Test Result (ppm)
|
|
RoHS
|
Halogen
|
|
Cr 6+
|
Cd
|
Hg
|
Pb
|
PBBs
|
PBDE
|
PFOA
|
PFOS
|
Br
|
Cl
|
F
|
I
|
|
2009..5.6
|
CE/2009/46912
|
SMD Chip LED
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
168
|
ND
|
ND
|
|
2008.9.16
|
CE/2008/92778
|
SMD Chip white LED
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
203
|
ND
|
ND
|
|
2008.6.9
|
CE/2008/52844
CE_2008_67884
|
SMD PLCC LED
|
ND
|
ND
|
ND
|
13
|
ND
|
ND
|
ND
|
ND
|
ND
|
70
|
ND
|
ND
|
|
2009.2.17
|
CE/2009/22174
|
SMD PLCC white LED
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
|
2009.5.6
|
CE/2009/46914, CE/2009/46915
|
SMD IR/PTR
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
271
|
ND
|
ND
|
|
2009.3.13
|
CE/2008/32083
|
MFP PC
|
ND
|
ND
|
ND
|
44
|
ND
|
ND
|
ND
|
ND
|
4590
|
154
|
ND
|
ND
|
|
2009.4.21
|
CE/2009/43235
|
DIP PC
|
ND
|
ND
|
ND
|
61
|
ND
|
ND
|
ND
|
ND
|
3340
|
159
|
ND
|
ND
|
|
2009.4.8
|
CE/2009/40245
|
Green MFP PC
|
ND
|
ND
|
ND
|
73
|
ND
|
ND
|
ND
|
ND
|
ND
|
92
|
ND
|
ND
|
|
2009/4.7
|
CE/2008/32084A
|
Green DIP PC
|
ND
|
ND
|
ND
|
46
|
ND
|
ND
|
ND
|
ND
|
ND
|
98
|
ND
|
ND
|
|
2009.2.16
|
CE/2009/21800
|
IRDA
|
ND
|
ND
|
ND
|
73
|
ND
|
ND
|
ND
|
ND
|
18900
|
379
|
289
|
ND
|
|
2009.5.6
|
CE/2009/46913
|
Photolink
|
ND
|
ND
|
ND
|
207
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
|
Test Date
|
Report No
|
Product
|
Test Result (ppm)
|
|
RoHS
|
Halogen
|
|
Cr 6+
|
Cd
|
Hg
|
Pb
|
PBBs
|
PBDEs
|
PFOS
|
Br
|
Cl
|
F
|
I
|
|
2009.7.25
|
1673912
|
Lamp
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
|
2009.7.25
|
1673911,
|
White Lamp
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
694
|
ND
|
ND
|
|
2009.4.1
|
1618430
|
Photocoupler (4PB)
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
4973
|
157
|
ND
|
ND
|
|
2009.4.1
|
1618431
|
Photocoupler (6PB)
|
ND
|
ND
|
ND
|
53
|
ND
|
ND
|
ND
|
5314
|
164
|
ND
|
ND
|
|
2009.4.1
|
1618432
|
Photocoupler (8PB)
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
6699
|
170
|
ND
|
ND
|
|
2009.4.1
|
1618433
|
Photocoupler (GP)
|
ND
|
ND
|
ND
|
26
|
ND
|
ND
|
ND
|
ND
|
107
|
ND
|
ND
|
|
Jul 28'2009
|
1675729
|
Numeric Display
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
Resin = 400, PCB = 56836
|
Ref+ink face = 67 Resin = 724, PCB = 993
|
Ref+ink face = 412
|
ND
|
WX:
|
Test Date
|
Report No
|
Product
|
Test Result (ppm)
|
|
RoHS
|
Halogen
|
|
Cr 6+
|
Cd
|
Hg
|
Pb
|
PBBs
|
PBDEs
|
PFOS
|
Br
|
Cl
|
F
|
I
|
|
2009..5.6
|
SHR09042993477034-1
|
IR Molding
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
15mg
/kg
|
353mg
/kg
|
ND
|
ND
|
|
2009..5.6
|
SHR09042993477037-1
|
IR Encap
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
3494m
g/kg
|
2592mg
/kg
|
ND
|
ND
|
|
2009..5.6
|
SHR09042993477036-1
|
PTR Molding
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
25mg
/kg
|
369mg
/kg
|
ND
|
ND
|
|
2009..5.6
|
SHR09042993477035-1
|
PTR Encap
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
ND
|
3199mg
/kg
|
1809mg
/kg
|
ND
|
ND
|
Remark:1)photointerrupt 沒有成品的協力廠商測試報告,只有原物料的協力廠商檢測報告
2)目前使用的膠水(ECLAT)為有鹵膠水,所以鹵素超標,而Compound是無鹵的,所以達到低鹵的要求.