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CAUTIONS for Lighting LED

1. Storage

Thedstoragedambientdshoulddnotdexceedd30@Cdtemperaturedord70%drelativedhumidity.
ItdisdrecommendeddthatdLEDsdoutdofdtheirdoriginaldpackagingdaredsoldereddwithindonedweek.
Fordextendeddstoragedoutdofdtheirdoriginaldpackaging,ditdisdrecommendeddthatdthedLEDsdbedstoreddindadsealeddcon-
tainerdwithdappropriateddesiccant,dordindaddesiccatorsdwithdnitrogendambient.d
LEDsdstoreddoutdofdtheirdoriginaldpackagingdfordmoredthandadweekdshoulddbedbakeddatdaboutd60ddegdCdfordatdleastd
24dhoursdbeforedsolderdassembly.

2. Assembly Consideration

ThisdsectiondprovidesdyoudthedrequirementsdtodmountdLightingdLEDdontodMetaldCoredPrinteddCircuitdBoardd(MCPCB)dfordop-
timaldheat-dissipationde ciency,dfordreliabledoperationsdofdyourdproductsdanddfordthedoptimaldperformancedyoudneed.d

DesigndrulesdduringdLightingdLEDdarraydandditsdassemblydprocedure
1.d ThermaldresistancedfromdthedLightingdLEDdtodthedambientdenvironmentdmustdbedkeptdatdminimumdleveldasdpos-
sible.dAnydheatdbarrierdwilldpreventdLightingdLEDdfromdrunningdatdoptimumdlightdoutputdperformance.
2.d ElectricaldinsulationdbetweendthedcontactsdotherdthandelectrosdofdLightingdLEDdanddthedMCPCBdisdrequired.dThed
exposeddmetaldpartdofdadLightingdLEDdisdnotdelectricallydneutral.dDodnotdelectricallydconnectdthisdareadtodanyd
electricaldtracesdordpadsdondyourdMCPCB.
3.d IfdyoudwantdtodminimizedthermaldresistancedbetweendLightingdLEDdanddyourdMCPCB,dusedthermallydconductived
adhesivedin-between.
4.d LightingdLEDdcandbedsoldereddindinfraredd(IR),dhotdbardsoldering,dfberdfocuseddIR,dordhanddsoldering.

MCPCBdSelection
TodselectdadsuitabledMCPCBdisdthedfrstdstepdindassembledLightingdLED.dAdMCPCBdconsistsdofdseveraldlayersdthatdprovided
bothdelectricaldconnectionsdanddadlowdthermaldresistancedpathdtodexternaldheatdsinksdapplied.dStandarddLightingdLEDd
arraysdusedaluminatesdMCPCBdthatdconsistsdofdthedfollowingdlayers:

1.d AluminumdBased(type:1050,dthickness:1.6dmm)
2.d ElectricaldInsulationdLayerd(Dielectric/Epoxydthickness:d100d m)
3.d CopperdLayerd(Copperdthickness:d35d md)
4.d SolderdMaskd(Solderdpastedthicknessdafterdrefowdprocess:d90d~d115d m)

3. Soldering Process

FollowingsdaredadrecommenddprocessdfowsdtodbuilddLightingdLEDdintodLightdSources.dPleasedmountdentiredrespectived
surfacedmountddevicesd(SMD),difdany,dondyourdMCPCBddesignateddbeforedLightingdLEDdassemblydprocess.

FordRefowdProcess
Refowdsolderingdtemperaturedprofle Lighting LED > Application Notes

1.d ThedupperdprofledisdavailabledthatdusedSnAgd(x=3.3-3.8)dCud(y=0.2-2.7)dsolderdpaste
2.d ThedlowerdprofledisdavailabledthatdusedSnPbdsolderdpaste

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